| 词条 | TO-126 |
| 释义 |
TO-126 is a type of semiconductor package for devices with three pins, such as transistors.[1] The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink. History and originThe JEDEC TO-126 descriptor is derived from the original full name for the package: Transistor Outline Package, Case Style 126. In the updated JEDEC outline system, the package is numbered as TO-225AA.[2] See also
References1. ^{{Citation |year = 1999 |title = BD135; BD137; BD139; NPN power transistors |publisher = Philips Semiconductors |url = http://pdf.datasheetcatalog.com/datasheet/philips/BD139-16.pdf |accessdate = 2013-12-09}} 2. ^{{Citation |year = 2001 |title = AN1040/D: Mounting Considerations For Power Semiconductors |publisher = On Semiconductor |url = http://www.onsemi.com/pub_link/Collateral/AN1040-D.PDF |accessdate = 2014-01-25}} }} External links
1 : Semiconductor packages |
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