“Localized pulsed electrodeposition”的意思、由来-开放百科全书

Localized pulsed electrodeposition (L-PED) is a technique for direct 3D printing of free-standing and layer-by-layer micro/nano-scale metallic structures at the tip of an electrolyte containing nozzle. The method follows the same principle for metal deposition as the traditional electrodeposition (electroplating), however the area of deposition is limited by the size of a liquid bridge (meniscus) formed between the nozzle tip and the substrate ^[1]. The unique advantage of the L-PED process is the possibility of the control over the spatial microstructure of the printed metal in 3D geometries by adjusting deposition parameters (peak current density, on time, off time, etc.). This method can be used in various applications in nanotechnology, in particular for 3-dimensional electronics and sensors.

3D Printing Process

A nozzle with a few microns to sub-micron tip, containing the electrolyte of the metal of interest, works as the printing tool bit. When the nozzle approaches the substrate, the meniscus is formed at the nozzle tip, and functions as a confined electrodeposition bath. A two-electrode configuration was employed for the L-PED process, consists of a working electrode (the substrate) and a counter electrode (a metal wire which is inserted within the micropipette). The metal ions are reduced at the growth front within the meniscus area and deposited at the substrate by application of an appropriate pulsed electric potential between the electrodes. The precise and controlled motion of the relative position of the nozzle and the substrate results in printing of desired 3D pure metallic objects.

Historical Background

The localized electrodeposition was first reported by a group at University of Illinois at Urbana-Champaign in 2006 ^[2], and was used to fabricate high-density and high quality interconnects and wire bonds ^[3]. A research group at University of Texas at Dallas studied the process further and determined that through the application of a pulsed voltage, nanotwinned metals can be 3D-printed. They demonstrated the ambient environment L-PED process for direct printing of 3D free-standing nanotwinned Cu nanostructures for the first time ^[4].

References

1. ^{{cite journal|title=Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures|journal=Nano Letters|date=2018|volume=18|issue=1|pages=208–214|doi=10.1021/acs.nanolett.7b03930|pmid=29257699|last1=Daryadel|first1=Soheil|last2=Behroozfar|first2=Ali|last3=Morsali|first3=S. Reza|last4=Moreno|first4=Salvador|last5=Baniasadi|first5=Mahmoud|last6=Bykova|first6=Julia|last7=Bernal|first7=Rodrigo A.|last8=Minary-Jolandan|first8=Majid}}
2. ^{{cite journal|title=Probe-based electrochemical fabrication of freestanding Cu nanowire array|journal=Applied Physics Letters|date=2006|volume=88|issue=83103|pages=083103|doi=10.1063/1.2177538|last1=Suryavanshi|first1=Abhijit P.|last2=Yu|first2=Min-Feng}}
3. ^{{cite journal|title=Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds|journal=Science|date=2010|volume=329|issue=5989|pages=313–316|doi=10.1126/science.1190496|pmid=20647464|url=http://science.sciencemag.org/content/329/5989/313|last1=Hu|first1=J.|last2=Yu|first2=M.-F.}}
4. ^{{cite journal|title=Microscale 3D Printing of Nanotwinned Copper|journal=Advanced Materials|volume=30|date=2017|issue=1705107|pages=1705107|doi=10.1002/adma.201705107|last1=Behroozfar|first1=Ali|last2=Daryadel|first2=Soheil|last3=Morsali|first3=S. Reza|last4=Moreno|first4=Salvador|last5=Baniasadi|first5=Mahmoud|last6=Bernal|first6=Rodrigo A.|last7=Minary-Jolandan|first7=Majid}}