1. Usage in flip chip method

2. See also

3. References

In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules.^[1] The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux.^[2]

A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability.^[3]

Usage in flip chip method

See also

• Head-in-pillow defect, a solder ball failure

References

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