| 词条 | FOUP |
| 释义 |
It is a specialised plastic enclosure designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or measurement.[3] FOUPs began to appear along with the first 300mm wafer processing tools in the mid 1990s. The size of the wafers and their comparative lack of rigidity meant that SMIF was not a viable technology. FOUPs were designed with the constraints of 300mm in mind, with the removable cassette being replaced by fins in the FOUP which hold the wafers in place, and the bottom opening door being replaced by a front opening door to allow robot handling mechanisms to access the wafers directly from the FOUP. The weight of a fully loaded 25 wafer FOUP at around 9 kilograms means that automated material handling systems are essential for all but the smallest of fabrication plants.{{Citation needed|date=March 2016}} To allow this, each FOUP has various coupling plates, pins and holes to allow the FOUP to be located on a load port, and to be manipulated by the AMHS (Automated Material Handling System). FOUPs may also contain RF tags that allow them to be identified by readers on tools, in the AMHS etc.{{Citation needed|date=March 2016}} FOUPs are available in several colors, depending on the customers wish. FOSBFOSB is an acronym for Front Opening Shipping Box, is used for transferring wafers between manufacturing facilities.[1]Manufacturers
See also
References1. ^1 {{cite book|author1=Yoshio Nishi|author2=Robert Doering|title=Handbook of Semiconductor Manufacturing Technology, Second Edition|url=https://books.google.com/books?id=PsVVKz_hjBgC&pg=SA33-PA3|date=9 July 2007|publisher=CRC Press|isbn=978-1-4200-1766-3|pages=33–}} {{DEFAULTSORT:Foup}}{{Industry-stub}}2. ^{{cite book|author1=Mikhail Baklanov|author2=Paul S. Ho|author3=Ehrenfried Zschech|title=Advanced Interconnects for ULSI Technology|url=https://books.google.com/books?id=9idy-DCVMKwC&pg=PT291|date=17 February 2012|publisher=John Wiley & Sons|isbn=978-1-119-96686-9|pages=291–}} 3. ^{{cite book|author1=Lars Mönch|author2=John W. Fowler|author3=Scott Mason|title=Production Planning and Control for Semiconductor Wafer Fabrication Facilities: Modeling, Analysis, and Systems|url=https://books.google.com/books?id=IWQkFtXFZ8sC&pg=PA144|date=12 September 2012|publisher=Springer Science & Business Media|isbn=978-1-4614-4471-8|pages=144–}} 2 : Semiconductor fabrication equipment|Semiconductor device fabrication |
| 随便看 |
|
开放百科全书收录14589846条英语、德语、日语等多语种百科知识，基本涵盖了大多数领域的百科知识，是一部内容自由、开放的电子版国际百科全书。