1. See also

2. References

A footprint or land pattern is the arrangement of pads (in surface-mount technology) or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board.^[1] The land pattern on a circuit board matches the arrangement of leads on a component.

Component manufacturers often produce multiple pin-compatible product variants to allow systems integrators to change the exact component in use without changing the footprint on the circuit board. This can provide large cost savings for integrators, especially with dense BGA components where the footprint pads may be connected to multiple layers of the circuit board.

See also

• Surface-mount technology
• Through-hole technology
• Chip carrier
• List of integrated circuit packaging types
• IPC (standards body)
• JEDEC (standards body)

References

• British Ambassador to Vietnam
• British Ambassador to Washington
• British Ambassador to Yemen
• British Ambassador to Zimbabwe
• British American Investment Company (Mauritius)
• British-American Oil
• British-American School
• British American School
• British American School (disambiguation)
• British-American School (Mexico City)
• British American School (Mexico State)
• British-American School (Mexico State)
• British American School, S.C.
• British American School (State of Mexico)
• British-American School (State of Mexico)
• British-American System of Units
• British American Tobacco Bangladesh
• British American Tobacco Bangladesh (BATB)
• British American Tobacco Bangladesh Company Limited
• British Amphibious Airlines
• British and American units of measure
• British and Chinese Corporation
• British and Dominions Film Corporation
• British and Dominions Imperial Studios
• British and Foreign Sailors' Society